Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

您目前所在的位置:首页 - 期刊简介 - 详细页面

中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第10卷    第2期    总第35期    2000年4月

[PDF全文下载]        

    

文章编号:1004-0609(2000)02-0199-04
Ni对Sn96.5Ag3.5/Cu之间扩散行为的阻挡作用
朱奇农,罗  乐,肖  克,杜黎光

(中国科学院上海冶金研究所,上海 200050)

摘 要: 研究了电镀Ni层和化学镀Ni-P合金层对Sn-Ag/Cu焊点扩散行为的影响,电子探针分析表明:化学镀Ni-P合金层能很好地阻止Sn-Ag/Cu焊点在焊接过程中的Cu,Sn互扩散和相互反应;而电镀Ni层则不能阻止Sn-Ag/Cu焊点在焊接过程中的Cu,Sn互扩散和相互反应,界面反应产物仍以Cu6Sn5为主。应用化学镀Ni-P合金作为Sn-Ag/Cu之间的扩散阻挡层可大大减少Sn/Cu金属间化合物的生成,有利于提高焊点的可靠性。

 

关键字:  扩散;电子器件封装;镍镀层;金属间化合物

Ni as diffusion barriers between eutectic Sn-Ag solder and Cu
ZHU Qi-nong, LUO Le, XIAO Ke, DU Li-guang

Shanghai Institute of Metallurgy, Chinese Academy of Sciences, Shanghai 200050, P.R.China

Abstract:The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint. Electrolessly plated Ni-P layer can obviously decrease the generation of Sn-Cu IMC at the interface of Sn-Ag/Cu, which is beneficial to improve the reliability of solder joint.

 

Key words: diffusion; electronic packing; nickel-plated layer; intermetallic compounds

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中国科学技术协会 主办:中国有色金属学会 承办:中南大学
湘ICP备09001153号 版权所有:《中国有色金属学报》编辑部
------------------------------------------------------------------------------------------
地 址:湖南省长沙市岳麓山中南大学内 邮编:410083
电 话:0731-88876765,88877197,88830410   传真:0731-88877197   电子邮箱:f_ysxb@163.com