(哈尔滨工业大学 材料科学与工程学院， 哈尔滨 150001)
摘 要: 以电子封装为应用对象， 通过合理选择一定粒径分布的SiC颗粒， 采用挤压铸造方法制备了SiC颗粒体积分数分别为50%， 60%和70%的3种SiCp/Al复合材料。 材料组织致密， 颗粒分布均匀。 复合材料的平均线热膨胀系数(20～100℃)随SiC含量的增加而降低， 在8.3×10-6～10.8×10-6/℃之间， 与Kerner模型预测值相符。 复合材料比强度和比刚度高， 均可以满足电子封装应用的技术要求。
关键字: SiC； 铝基复合材料； 热膨胀； 电子封装
with high content of SiCp
（School of Materials Science and Engineering,
Harbin Institute of Technology, Harbin 150001, China）
Abstract:SiCp/Al composites with SiCp volume fractions of 50%, 60% and 70% for electronic packaging applications were fabricated using squeeze casting technology. The composites appear to be free of pores, and the SiC particles distribute uniformly in the composites. The mean linear coefficient of thermal expansion (20～100℃) of SiCp/Al composites ranges from 8.2×10-6 to 10.8×10-6/℃ and decreases with increasing SiCp content. The measured coefficients of thermal expansion agree well with Kerner’s model. The composites show high specific bending strength and modulus. This can meet the technical requirements for electronic packaging.
Key words: SiC; aluminum matrix composites; thermal expansion; electronic packaging
