(山东大学 材料科学与工程学院, 济南 250061)
摘 要: 采用真空扩散焊工艺方法，对Cu与Al扩散焊接头的组织性能进行了试验研究，利用扫描电镜(SEM)、电子探针(EPMA)、显微硬度等测试方法对焊接过渡区及基体组织和性能进行了分析。试验结果表明： 采用真空扩散焊工艺，在加热温度520～540 ℃，保温时间60 min，压力11.5 MPa时，在Cu/Al界面处形成明显的扩散过渡区，扩散区域宽约40 μm。在铜侧过渡区中产生金属间化合物，会出现显微硬度高峰区， 控制Al的扩散浓度可避免或减少界面处金属间化合物的产生。
关键字: 铜； 铝； 真空扩散焊； 显微组织
joint of copper and aluminum
（School of Materials Science and Engineering,
Shandong University,Jinan 250061, P.R.China）
Abstract:By using vacuum diffusion welding process, the microstructures and performance of diffusion transition zone for the Cu/Al diffusion welding joint were researched by means of SEM, EPMA and micro-hardness test. The results indicate that under the condition of 520～540 ℃ in holding time 60 min and pressure 11.5 MPa, the diffusion joined interface is obviously produced between copper and aluminum. The width of the diffusion interface zone is about 40 μm. The microhardness peak zone is formed in the copper side of the joined interface because of metal compounds such as γ and β phase. By controlling the Al diffusion amount, the brittle intermetallic compounds can be avoided or decreased.
Key words: copper; aluminum; vacuum diffusion welding; microstructure
