(1. 大连理工大学 化工学院， 大连 116012；
2. 沈阳工业大学 理学院， 沈阳 110023)
摘 要: 研究了一种新型可焊性镀层 含银量3%的锡银合金的电镀工艺，选择甲基磺酸亚锡和甲基磺酸银为主盐，柠檬酸钠、碘化钾和三乙醇胺为络合剂，研制了镀覆含银量为3％的最佳镀液配方和施镀工艺条件。 通过对镀层可焊性、抗高温氧化性能和表面接触电阻等性能的考察发现，低含银量的锡银合金镀层性能优于锡铅合金镀层，且镀液成分简单、性能稳定、无毒无害，具有广泛的应用前景。
关键字: 电镀； Sn-Ag合金； 可焊性镀层
solderable coatings from methanesulfonate bath
（1. School of Chemical Engineering, Dalian University of Technology,
Dalian 116012, P.R.China；
2. School of Science, Shenyang University of Technology,
Shenyang 110023, P.R.China）
Abstract:A new solderable coating-SnAg (3%Ag) alloy is recommended as a substitute for SnPb alloy coating. The processes of electroplating SnAg (3%Ag) alloy from methanesulfonate bath were studied. The sorts of main salts, complexing agents and additives were determined. The bath functions such as stability, covering power, throwing power, current efficiency, deposition velocity and cathodic polarization curves were tested. The surface appearances were observed.
Key words: electroplating; SnAg alloy; solderable coating
