(1. 河南科技大学 材料科学与工程学院，洛阳 471003；
2. 河南科技大学 河南省有色金属材料科学与加工技术重点实验室，洛阳 471003)
摘 要: 通过在Bi5Sb中添加不同含量的Cu形成新型BiSbCu三元合金。结果表明：在Bi5Sb钎料合金中添加0.5%~5.0%(质量分数)Cu，BiSbCu钎料合金的熔点变化不大，但其润湿性能和力学性能明显改善；当Cu含量为1.5%时，(Bi5Sb)1.5Cu钎料合金的润湿性能和力学性能最好，与基体Bi5Sb相比，(Bi5Sb)1.5Cu的铺展面积增大57.8%，抗拉强度提高212.4%；随着Cu含量的增大，针状组织Cu2Sb的含量逐渐增多，钎料合金性能下降。
关键字: Bi5Sb钎料合金；Cu；润湿性能；力学性能
（1. College of Material Science and Engineering, Henan University of Science and Technology,
Luoyang 471003, China;
2.Henan Key Laboratory of Advanced Non-ferrous Metals, Henan University of Science and Technology,
Luoyang 471003, China）
Abstract:A new BiSbCu ternary alloy was formed by adding different contents of Cu into Bi5Sb solder alloy to improve its wettability and mechanical properties. The results show the effect of adding 0.5%−5.0% (mass fraction) Cu into Bi5Sb on the melting point of Bi5Sb solder alloy is not distinct, whereas the wettability and mechanical property are remarkably improved. Compared with the Bi5Sb matrix, the spreading area of (Bi5Sb)1.5Cu solder alloy increases 57.8% and the tensile strength increases 212.4% when the content of Cu is 1.5%. The number of needle-like Cu2Sb gradually increases with increasing Cu content, which weakens the properties of the solder alloy.
Key words: Bi5Sb solder alloy; Cu; wettability; mechanical property
