(哈尔滨工业大学 材料科学与工程学院， 哈尔滨 150001)
摘 要: 采用专利挤压铸造方法制备了3种Mo体积分数分别为55%、 60%和67%的Mo/Cu复合材料， 并对其微观组织和导热性能进行了研究。 结果表明： Mo颗粒分布均匀， Mo/Cu界面干净， 不存在任何界面反应物和非晶层； 复合材料组织均匀、 致密， 且致密度高达99%以上； 复合材料的热导率为220~270 W/(m·K)， 并随着Mo含量的增加而降低。 混合定律(ROM)较好地预测了55%Mo/Cu复合材料的热导率， 而采用Maxwell模型和H-M模型的计算值与60%和67%Mo/Cu复合材料的热导率测试值一致。
关键字: Mo/Cu复合材料； 致密度； 热导率
（ School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China）
Abstract: Mo/Cu composites with Mo volume fractions of 55%, 60% and 67% were fabricated by the patented squeeze-casting technology, and the microstructures and thermal conduction properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniform, and the Mo/Cu interfaces are clean and free from interfacial reaction products or amorphous layers. The relative density of the Mo/Cu composites is higher than 99%. The thermal conductivity of Mo/Cu composites is 220-270 W/(m·K), which can meet the demands of high thermal conductivity for electronic package. The thermal conductivities of Mo/Cu composites decrease with the increase of Mo volume fraction. The ROM model can well predicate the thermal conductivities of 55%Mo/Cu composites, while the values calculated by Maxwell model and H-M Model agree well with the thermal conductivities of 60% and 67%Mo/Cu composites.
Key words: Mo/Cu composites; density; thermal conductivity
