Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第15卷    第11期    总第80期    2005年11月

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文章编号: 1004-0609(2005)11-1780-06
磺基水杨酸对镍硫合金涂层结构及电化学性能的影响
何捍卫, 刘红江, 周科朝

(中南大学 粉末冶金国家重点实验室, 长沙 410083)

摘 要:  以硫脲为硫源、 磺基水杨酸为改性剂, 采用改进的Watt浴体系电沉积制备镍-硫合金涂层电极, 用SEM观察涂层表面形貌, XRD分析涂层结构与相组成, 电化学测试方法分析涂层的电化学行为。 结果表明, 磺基水杨酸在电沉积过程中既促进了晶核的形成, 又阻碍了晶粒的长大, 导致Ni-S沉积层的晶粒细化、 非晶态化程度和硫含量的提高。 所制备的Ni-S合金涂层具有较好的附着力, 用于碱性水电解时有较高的析氢活性。 当镀液中磺基水杨酸浓度为5 g/L时, Ni-S合金镀层附着力增大至19 MPa, 析氢过电位降低约13 mV。

 

关键字:  磺基水杨酸; Ni-S沉积层; 电化学活性; 附着力

Effect of sulphosalicylic acid on structures and electrochemical properties of nickel sulphur alloy coatings
HE Han-wei, LIU Hong-jiang, ZHOU Ke-chao

State Key Laboratory of Powder Metallurgy, Central South University,
 Changsha 410083, China

Abstract: Nickel-sulphur alloy coating electrodes were prepared on the nickel substrates by electrodeposition method in a modified Watts using thiourea (TU) and sulphosalicylic acid as sulphur source and modifier, respectively. Adsorption effect of sulphosalicylic acid on the electrochemical activities, grain sizes, textures and sulphur contents of Ni-S deposits were studied by means of electrochemical methods, SEM and X-ray diffraction. The results show that the sulphosalicylic acid accelerates the nucleation processes and hinders grain growth. The Ni-S deposits obtained from bath containing sulphosalicylic have higher sulphur contents, obvious amorphous textures and much smaller grain sizes than those from the bath without additive. Ni-S alloys as a cathode materials of alkaline water electrolysis have higher hydrogen evolution activities and better adhesion. The adhesion increases with the increase of sulphosalicylic acid concentration, and reaches 19 MPa at 5 g/L sulphosalicyclic acid. At the same time, the hydrogen evolution overpotential is the lowest at 5 g/L sulphosalicylic acid, which is 13 mV lower than that of the bath without additive.

 

Key words: sulphosalicylic acid; Ni-S deposits; electrochemical activity; adhesion

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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