(浙江大学 金属材料研究所， 杭州 310027)
摘 要: 化学镀是制备纳米颗粒增强金属基复合材料的有效方法。对纳米Al2O3p化学镀铜粉末的烧结致密化特点进行了研究，分析了化学镀粉末的预处理、 成型压力、 烧结温度、 保温时间、 复压复烧工艺等对致密化的影响。 在优化各影响因素的情况下， 对Al2O3含量为10%的化学镀铜粉末采用常规粉末冶金工艺得到了相对致密度达94%的试样。
关键字: 铜基复合材料； 纳米氧化铝； 粉末冶金； 致密化； 化学镀
electroless copper plating
（Institute of Metallic Materials, Zhejiang University, Hangzhou 310027, China）
Abstract: Electroless plating is an effective method to prepare various metal/ceramic compounds， which can get a high mixing homogeneity and improved metal/ceramic interface bond in metal matrix composites(MMCs) reinforced by ceramic. The characteristics of sintering densification of Cu/Al2O3p composites were investigated. The influences of powder preparation, pressing pressure, sintering temperature, soaking time and repressing-resintering on the densification were studied. On the basis of optimizing parameters， the relative density of Cu/nano-Al2O3p with norminal content of 10% Al2O3(mass fraction) can reach 94% via conventional powder metallurgy.
Key words: copper matrix composites； nano-Al2O3； powder metallurgy； densification； electroless plating
