(上海交通大学 金属基复合材料国家重点实验室, 上海 200030)
摘 要: 采用复合电铸工艺制备碳化硅颗粒(SiCp)增强铜基复合材料, 研究了镀液中颗粒浓度、 镀液温度、 电流密度对v复合材料中SiCp含量的影响。 通过优化各工艺参数可有效促进SiCp与铜的共沉积, 提高复合材料中增强固体颗粒的含量。 结果表明: 随着SiCp含量增加,Cu/SiCp复合材料的热膨胀系数和导热系数减小, 抗弯强度和硬度提高。 此外, 复合电铸工艺制备的复合材料具有较大内应力, 对Cu/SiCp复合材料的热膨胀性能和硬度有一定影响。
关键字: 复合电铸; 碳化硅颗粒; 铜基复合材料
(State Key Laboratory of Metal Matrix Composites,
Shanghai Jiaotong University, Shanghai 200030, China)
Abstract: The SiCp reinforced copper-based composites was prepared by using composite electroforming technology. The influences of the concentration of SiCp in plating solution, the temperature of plating solution, and current density on the SiCp content in Cu/SiCp composites were studied. The results show that through optimizing the technology parameters, it could promote co-deposition of Cu and SiCp effectively and increase SiCp volume content in composites. The results indicate that with increasing SiCp content, CTE (coefficient of thermal expansion) and conductivity factor decrease, but bend strength and HV(Vickers-hardness) increase. Besides, internal stress exist in Cu/SiCp composites fabricated by composite electroforming, which has influences on HV and thermal expansion property of Cu/SiCp composites.
Key words: composite electroforming; SiCp; copper-based composites