Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第14卷    第1期    总第58期    2004年1月

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文章编号:1004-0609(2004)01-0084-04
复合电铸制备Cu/SiCp复合材料
朱建华, 刘 磊, 胡国华, 沈 彬, 胡文彬, 丁文江

(上海交通大学 金属基复合材料国家重点实验室, 上海 200030)

摘 要: 采用复合电铸工艺制备碳化硅颗粒(SiCp)增强铜基复合材料, 研究了镀液中颗粒浓度、 镀液温度、 电流密度对v复合材料中SiCp含量的影响。 通过优化各工艺参数可有效促进SiCp与铜的共沉积, 提高复合材料中增强固体颗粒的含量。 结果表明: 随着SiCp含量增加,Cu/SiCp复合材料的热膨胀系数和导热系数减小, 抗弯强度和硬度提高。 此外, 复合电铸工艺制备的复合材料具有较大内应力, 对Cu/SiCp复合材料的热膨胀性能和硬度有一定影响。

 

关键字: 复合电铸; 碳化硅颗粒; 铜基复合材料

Composite electroforming of Cu/SiCp composites
ZHU Jian-hua, LIU Lei, HU Guo-hua, SHEN Bin, HU Wen-bin,
DING Wen-jiang

State Key Laboratory of Metal Matrix Composites,
Shanghai Jiaotong University, Shanghai 200030, China

Abstract: The SiCp reinforced copper-based composites was prepared by using composite electroforming technology. The influences of the concentration of SiCp in plating solution, the temperature of plating solution, and current density on the SiCp content in Cu/SiCp composites were studied. The results show that through optimizing the technology parameters, it could promote co-deposition of Cu and SiCp effectively and increase SiCp volume content in composites. The results indicate that with increasing SiCp content, CTE (coefficient of thermal expansion) and conductivity factor decrease, but bend strength and HV(Vickers-hardness) increase. Besides, internal stress exist in Cu/SiCp  composites fabricated by composite electroforming, which has influences on HV and thermal expansion property of Cu/SiCcomposites.

 

Key words: composite electroforming; SiCp; copper-based composites

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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