(1. 北京有色金属研究总院
国家有色金属复合材料工程技术研究中心， 北京 100088;
2. 北京科技大学 新金属材料国家重点实验室， 北京 100085)
摘 要: 利用喷射成形技术制备了60Si40Al合金新型电子封装材料。 研究了各工艺参数对沉积坯件的影响， 确定了较佳工艺参数。 研究了材料的显微组织以及沉积态合金在加热保温过程中的组织转变规律， 确定了热等静压温度， 进行了热等静压致密化处理。 研究结果表明： 材料显微组织细小， 一次硅相尺寸约为10μm， 且均匀弥散分布， 该材料的热膨胀系数为9×10-6~10×10-6/K， 热导率约为110W/(m·K)， 是一种理想的电子封装材料。
关键字: 喷射成形; 60Si40Al合金; 封装材料; 热等静压
（ 1. National Engineering & Technology Research Center for Nonferrous MMCs,
Beijing General Research Institute for Nonferrous Metals, Beijing 100088, China;
2. State Key Laboratory for Advanced Metals and Materials,
University of Science and Technology Beijing,
Beijing 100085, China）
Abstract: A novel 60Si40Al alloy packaging material for electronic applications was prepared by spray forming technology. The effect of parameter upon performs, the microstructures produced from spray forming process, and the hot isostatic pressing(HIP) process were studied. The results show that Si phase is fine and dispersion, the microstructure of performs from spray forming is fine and uniform, the thermal expansivity(CTE) is about 9×10-6~10×10-6/K, and the thermal conductivity is about 110W/(m·K).
Key words: spray forming; 60Si40Al alloy; packaging material; HIP
