( 1. 北京科技大学 物理化学系, 北京 100083;
2. 昆明理工大学 材料冶金工程学院, 昆明 650093)
摘 要: 阐述了无铅钎料合金设计的原则, 讨论了合金相图及其计算在无铅锡基钎料合金设计中的作用。 利用相图计算技术筛选了可能代替Pb-Sn共晶钎料合金的Sn-Zn-In三元(x(Zn)<0.11, x(In)=0.10~0.14)和Sn-Zn-In-Ag四元(x(Sn)=0.800, x(In)=0.090, x(Zn)=0.075, x(Ag)<0.049)无铅锡基钎料合金。 初步讨论了用相图计算技术在富Sn四元Sn-Zn-In-Ag无铅钎料合金基础上, 添加Bi, Sb等低熔点金属和微量Ce, La等稀土元素以降低贵金属In和Ag的含量, 进一步提高无铅锡基多元合金钎料的综合性能和性能价格比。
关键字: 钎料合金; 无铅钎料; 相图; 相图计算
( 1. Department of Physical Chemistry, University of Science and Technology Beijing,Beijing 100083, China;
2. School of Materials and Metallurgical Engineering,
Kunming University of Science and Technology,
Kunming 650093, China)
Abstract: The principles for lead-free solder alloy design and the importance of phase diagram study as well as the calculation of phase diagram(CALPHAD) approach in the lead-free solder alloy design are discussed. Based on CALPHAD approach two potential lead-free solder alloys, i.e., the Sn-Zn-In(x(Zn)<0.11, x(In)=0.10-0.14)ternary alloy and the Sn-Zn-In-Ag(x(Sn)=0.800, x(In)=0.090, x(Zn)=0.075, x(Ag)<0.035)quaternary alloy are recommended as lead-free solder alloy instead of the Pb-Sn eutectic solder alloy. The further work for decreasing the content of In and Ag in Sn based Pb-free multi-component alloy with excerlent properties is brief discussed.
Key words: solder alloy; Pb-free solder; phase diagram; CALPHAD