Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第14卷    第11期    总第68期    2004年11月

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文章编号:1004-0609(2004)11-1789-10
无铅锡基钎料合金设计和合金相图及其计算
乔芝郁1, 谢允安1, 曹战民1, 袁文霞1, 孙 勇2, 祁更新2

( 1. 北京科技大学 物理化学系, 北京 100083;
2. 昆明理工大学 材料冶金工程学院, 昆明 650093
)

摘 要: 阐述了无铅钎料合金设计的原则, 讨论了合金相图及其计算在无铅锡基钎料合金设计中的作用。 利用相图计算技术筛选了可能代替Pb-Sn共晶钎料合金的Sn-Zn-In三元(x(Zn)<0.11, x(In)=0.10~0.14)和Sn-Zn-In-Ag四元(x(Sn)=0.800, x(In)=0.090, x(Zn)=0.075, x(Ag)<0.049)无铅锡基钎料合金。 初步讨论了用相图计算技术在富Sn四元Sn-Zn-In-Ag无铅钎料合金基础上, 添加Bi, Sb等低熔点金属和微量Ce, La等稀土元素以降低贵金属In和Ag的含量, 进一步提高无铅锡基多元合金钎料的综合性能和性能价格比。

 

关键字: 钎料合金; 无铅钎料; 相图; 相图计算

Design of lead free solder alloy and alloy phase diagram calculation
QIAO Zhi-yu1, XIE Yun-an1, CAO Zhan-min1, YUAN Wen-xia1,
 SUN Yong2, QI Geng-xin2

1. Department of Physical Chemistry, University of Science and Technology Beijing,Beijing 100083, China;
2. School of Materials and Metallurgical Engineering,
Kunming University of Science and Technology,
 Kunming 650093, China

Abstract: The principles for lead-free solder alloy design and the importance of phase diagram study as well as the calculation of phase diagram(CALPHAD) approach in the lead-free solder alloy design are discussed. Based on CALPHAD approach two potential lead-free solder alloys, i.e., the Sn-Zn-In(x(Zn)<0.11, x(In)=0.10-0.14)ternary alloy and the Sn-Zn-In-Ag(x(Sn)=0.800, x(In)=0.090, x(Zn)=0.075, x(Ag)<0.035)quaternary alloy are recommended as lead-free solder alloy instead of the Pb-Sn eutectic solder alloy. The further work for decreasing the content of In and Ag in Sn based Pb-free multi-component alloy with excerlent properties is brief discussed.

 

Key words: solder alloy; Pb-free solder; phase diagram; CALPHAD

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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