Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第15卷    第10期    总第79期    2005年10月

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文章编号: 1004-0609(2005)10-1520-06
轰击能量对离子束辅助磁控溅射沉积Cr-N薄膜
断裂韧性的影响
田林海1, 2,宗瑞磊1, 朱晓东1,唐 宾2, 何家文1

( 1. 西安交通大学 金属材料强度国家重点实验室, 西安 710049;
2. 太原理工大学 表面工程研究所, 太原 030024
)

摘 要:  应用低能离子束辅助磁控溅射技术(IBAMS)沉积CrN薄膜, 用场发射扫描电镜(FESEM)、原子力显微镜(AFM)和X射线衍射表征薄膜的组织结构, 讨论了轰击能量对CrN薄膜组织、 晶粒度以及硬度和断裂韧性的影响。 结果表明: 随离子束辅助轰击能量的升高, Cr-N薄膜由粗大的柱状晶变为细小的晶粒, 当轰击能量达到1 200 V时,薄膜呈现等轴晶结构, 薄膜致密度增加。 FESEM得到的表面颗粒尺寸和AFM得到的粗糙度随轰击能量升高呈现相同的变化趋势,这些表观大颗粒是由许多小的亚晶块聚集而成。 进一步用X射线衍射谱形分析表明: 随轰击能量从0 V升高到800 V时, 亚晶块的尺寸逐渐减小; 到800 V时, 晶块尺寸约为9 nm, 但当能量升到1 200 V时, 晶块尺寸反而增大, 这是由离子束辅助轰击导致的两种不同机制而引起的, 一种是离子轰击导致的喷丸碎化作用,而另一种为热效应引起的晶粒长大; 当轰击能量从0 V增加800 V时,薄膜的硬度和断裂韧性都显著提高, 与晶粒度的减小有关; 而到1 200 V时, 晶粒度较未辅助略大, 但却具有很高的硬度以及较高的断裂韧性,说明硬度和断裂韧性的提高还与离子束轰击导致薄膜的致密化增加有关。

 

关键字:  离子轰击; 晶粒度; 硬度; 断裂韧性

Effect of ion bombardment on fracture toughness of Cr-N coatings deposited by ion beam assisted magnetron sputtering
TIAN Lin-hai12, ZONG Rui-lei1, ZHU Xiao-dong1
TANG Bin2, HE Jia-wen1

1. State Key Laboratory for Mechanical Behaviour of Materials,
Xi'an Jiaotong University, Xi'an 710049, China;
2. Research Institute of Surface Engineering,
Taiyuan University of Technology, Taiyuan 030024, China

Abstract: Cr-N films were deposited by low energy ion assisted magnetron sputtering (IBAMS). The microstructure was characterized by FESEM, AFM and XRD analysis. The effects of ion bombardment energy on microstructure, grain size, hardness and fracture toughness of Cr-N films were studied. The results show that, with the increase of ion energy, the Cr-N film changes from large columnar structure to fine dense grains. When the assisted ion energy reaches 1 200 V, the structure changes to equiaxial and the film density increases. The aggregation observed by FESEM and roughness by AFM change with the bombarding ion energy increasing in similar trend. However, the aggregate particles compose of many small sub-grains, which are analyzed by X-ray diffractrometry. The sub-grain size decreases when the bombarding ion energy increases from 0 to 800 V and reaches about 9 nm at 800 V. However, it increases again at 1 200 V. The results suggest that two different mechanisms take place during ion bombardment. One is peening effect which results in grain refining and the other is thermal effect leading to grain growth. Both the hardness and fracture toughness increase with the energy increasing from 0 to 800 V, which could relate to the decrease of grain size. The grain size at energy of 1 200 V closes to that of 0 V, but the hardness and fracture toughness is higher than that of 0 V. It suggests that the improvement of hardness and fracture toughness relates to the densification of the film deposited by ion bombardment.

 

Key words: ion bombardment; grain size; hardness; fracture toughness

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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