( 1. 北京航空航天大学 材料科学与工程学院， 北京 100083;
2. 中南大学 粉末冶金国家重点实验室， 长沙 410083)
摘 要: 用Ti3SiC2粉末作为焊料， 采用热压反应烧结连接法连接SiC， 通过正交实验， 研究了连接温度、 高温保温时间、 连接压力和连接层厚度对试样连接强度的影响， 优选出的最佳工艺参数分别为： 1500 ℃， 30 min， 30 MPa， 150 μm。 所得到的接头最大剪切强度为39.49 MPa。 微观结构研究和成分分析表明： 在界面处， 发生了元素的扩散， 促进了界面结合， 有明显的反应扩散层。 物相分析显示在高温、 高压、 氩气气氛以及使用石墨模具的条件下， Ti3SiC2与母材发生界面反应， 实现界面结合。
关键字: 陶瓷连接； 特种连接； Ti3SiC2 ； SiC陶瓷
（ 1. School of Materials Science and Engineering,
Beijing University of Aeronautics and Astronautics,
Beijing 100083, China;
2. State Key Laboratory of Powder Metallurgy,
Central South University, Changsha 410083, China）
Abstract: The joining of RBSiC to RBSiC was successfully realized by hot pressing reaction joining process using Ti3SiC2 powder as filler. The optimized technological parameters were obtained by orthogonal experiments, which are the joining temperature of 1 500 ℃, the dwelling time of 30 min, the joining pressure of 30 MPa and the interlayer thickness of 150 μm. Under these conditions, the obtained shearing strength of the joint is 39.49 MPa. The mechanism of bonding was investigated based on observation of the microstructure, determination of distribution of the elements and phase analysis at the welded area, which show that the mechanism of bonding at the interfaces is interdiffusion and interfacial reaction.
Key words: ceramic joining; special joining; Ti3SiC2; SiC ceramic
