(中南大学 材料科学与工程学院，长沙 410083)
摘 要: 通过对快速凝固高硅铝合金粉末(Al-30%Si)进行真空包套热挤压， 制备出高硅铝合金电子封装材料， 研究了粉末粒度对高硅铝合金材料组织及性能的影响。 利用金相显微镜、 扫描电镜、 万能电子拉伸机、 差热分析仪、 TR-2热物性测试仪等设备系统测试和分析了该材料的显微组织、 力学和物理性能。 结果表明： 原始粉末颗粒尺寸大小能显著影响材料热挤压后的显微组织和性能。 原始粉末颗粒越细小， 其硅相越细小、 抗拉强度和致密度越高、 气密性越好、 热导率和热膨胀系数越低。
关键字: 高硅铝合金; 电子封装材料; 快速凝固; 热挤压; 热膨胀系数; 热导率
（ School of Materials Science and Engineering, Central South University,
Changsha 410083, China）
Abstract: Two kinds of high silicon aluminum alloys, applied in lightweight electronic packaging material in the aviation and space fields, were prepared with the rapidly solidified high-silicon aluminum alloy(Al-30%Si) powder by vacuum canning and hot-extrusion processes. The effect of particle size on the microstructure and properties of high-silicon aluminum alloys was studied by optical microscopy, scanning electron microscopy, universal material testing machine, thermal analyzer and TR-2 thermal physics test. The experimental results show that, the original particle size can greatly affect the microstructure and properties of the alloy. If the original particles are small, the final silicon crystal size will be small, the tensile strength is high, the relative density is high and the hermeticity is good, the thermal conductivity and the coefficients of thermal expansion of the alloy are low.
Key words: high silicon aluminum alloy; electronic packaging material; rapid solidification; hot extrusion; thermal expansion coefficient; thermal conductivity
