(河南科技大学 材料科学与工程学院， 洛阳 471003)
摘 要: 采用润湿平衡法选用商用水洗钎剂， 研究SnAgCuRE系无铅钎料与表面贴装元器件的润湿适配性。 研究结果表明， 当Sn2.5Ag0.7CuxRE系钎料合金中RE添加量为0.1%时， 在钎焊温度为250 ℃、 预热时间为15 s、 浸渍时间为5 s的情况下， 其与表面贴装元器件具有较好的润湿适配性, 即具有较大的润湿力、 较小的润湿角， 其润湿力达到现行商用Sn3.8Ag0.7Cu钎料的水平, 完全能够满足表面组装行业对无铅钎料润湿性能的要求。
关键字: 无铅钎料； 表面贴装元件； 润湿性能； 润湿力
（College of Materials Science and Engineering,
Henan University of Science and Technology, Luoyang 471003, China）
Abstract: The wetting match performances of SnAgCuRE lead-free solder for surface mount component by adopting commercial water-soluble flux were investigated by means of wetting balance methods. The experimental results show that the Sn2.5Ag0.7CuxRE solder alloy has better wetting match proprieties for surface mount component with the addition of 0.1% rare earth at soldering temperature of 250 ℃, preheating time of 15 s and soldering time of 5 s, i.e. it has higher wetting force and smaller wetting angle. The wetting force of Sn2.5Ag0.7Cu0.1RE is in the same level as that of commercial Sn3.8Ag0.7Cu solder, which can meet the wetting property standard to the lead-free solders of surface mount technology industry.
Key words: lead-free solder; surface mount component; wetting property; wetting force
