Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第16卷    第10期    总第91期    2006年10月

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文章编号:1004-0609(2006)10-1793-06
新型Ag-Cu-Ge钎料的性能及钎焊界面特征
岳译新1, 谭澄宇1, 郑子樵1, 李世晨1, 叶建军2

(1. 中南大学 材料科学与工程学院,长沙 410083;
2. 南京电子器件研究所, 南京 210016
)

摘 要:  根据Ag-Cu-Ge系三元相图, 制备了Ag-Cu33.4-Ge28.1, Ag-Cu43-Ge20 (质量分数, %)两种中温合金钎料。 利用金相显微镜、 DTA对钎料组织及其熔点进行分析,并对其润湿性进行测试。 结果表明: 两种合金钎料的熔化温区为539~622 ℃, Ag-Cu33.4-Ge28.1合金对于纯Ni和Cu具有良好的漫流性和润湿性。 利用扫描电镜和能谱仪对钎焊后的界面微观组织进行观察与分析, 发现在界面处形成了固溶体和金属间化合物。

 

关键字:  Ag-Cu-Ge; 钎料; 润湿性; 界面

Properties and interface microstructure of
new type Ag-Cu-Ge solder
YUE Yi-xin1, TAN Cheng-yu1, ZHENG Zi-qiao1,
LI Shi-chen1, YE Jian-jun2

1. School of Materials Science and Engineering,
Central South University, Changsha 410083, China;
2. Nanjing Electronic Devices Institute, Nanjing 210016, China

Abstract: According to Ag-Cu-Ge phase diagram, two solders Ag-Cu33.4-Ge28.1 and Ag-Cu43-Ge20 (mass fraction, %) were designed. The microstructure and melting point of two solders were studied by optical microscope and differential thermal analysis(DTA), and the wettability of solders with base metal was tested. The results show that, the melting temperatures of the two solders are in the range of 539-622 ℃, Ag-Cu33.4-Ge28.1 solder has good flowability and wettability to Ni and Cu substrates. The scanning electron microscope equipped with energy dispersive X-ray (EDX) analysis system was used to inspect and analyze the interfacial microstructure, and the solid solution and intermetallic compounds were found in interface.

 

Key words: Ag-Cu-Ge; solder; wettability; interface

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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