化合物的生长行为
(北京科技大学 材料科学与工程学院，北京 100083)
摘 要: 对热-剪切循环条件下Sn-3.5Ag-0.5Cu/Cu和Sn-Pb/Cu界面上原子扩散和化合物的生长行为进行了研究。 结果表明： 再流焊后， 在两界面上均形成一种Cu6Sn5化合物； 随着热剪切循环周数的增加， 两界面上化合物的形态均从扇贝状向层状生长，其厚度随循环周数的增加而增加， 且生长基本遵循抛物线规律， 说明Cu原子的扩散控制了Cu6Sn5化合物的生长。 界面近域的钎料内， 颗粒状的Ag3Sn聚集长大成块状。
关键字: Sn-3.5Ag-0.5Cu钎料； Sn-Pb钎料； 热剪切循环； 金属间化合物
Sn-3.5Ag-0.5Cu/Cu and Sn-Pb/Cu
interfaces during thermal-shearing cycling
（School of Materials Science and Engineering,
University of Science and Technology Beijing, Beijing 100083, China）
Abstract: The atoms diffusion and growth behavior of intermetallic compounds (IMCs) at Sn-Ag-Cu/Cu and Sn-Pb/Cu interfaces under the thermal-shearing cycling condition were investigated. The results show that Cu6Sn5 forms at the two interfaces, and its thickness increases with the thermal-shearing cycling. The morphology of Cu6Sn5 varies from scallop-type to planar-type with increasing thermal-shearing cycling periods. The IMC growth follows growth kinetics of parabola, implying that IMC growth is controlled by Cu atom diffusion. In the solder, branch-like Ag3Sn forms after reflowing, congregates to grow up to planar after thermal-shearing cycling.
Key words: Sn-3.5Ag-0.5Cu solder; Sn-Pb solder; thermal-shearing cycling; intermetallic compound(IMC)
