(南京航空航天大学 机电工程学院, 南京 210016)
摘 要: 在铜的电铸过程中， 通过陶瓷微珠等硬质粒子摩擦和扰动电铸层表面来改善电铸层的质量。 对所制备的铜电铸层的表面形貌、 织构等微观结构和显微硬度、 抗腐蚀等性能进行测试和分析， 并与传统方法所制备的铜电铸层相比较。 结果表明： 硬质粒子在电铸过程中对电铸层表面的摩擦和扰动具有显著的除瘤和整平作用， 使所制备的铜电铸层外观光亮平整， 显著改变其微观结构和性能； 铜电铸层各晶面的衍射强度降低， (200)晶面的择优程度减小， (111)晶面的择优程度增大； 显微硬度值由HV156增至HV221； 抗腐蚀性能显著提高， 在NaCl溶液中的腐蚀速率降低了20％。
关键字: 铜； 硬质粒子； 电铸； 电沉积； 结构； 性能
electroformed copper
（School of Mechanical and Electrical Engineering, Nanjing University of Aeronaustics and Astronaustics, Nanjing 210016, China）
Abstract: During the electroforming process of copper, the quality of electrodes was improved through polishing and perturbation of hard particles. The morphology and texture of the deposits were studied in contrast with that of the deposits obtained by traditional methods. The values of microhardness and corrosion rate in NaCl solution were also measured. The results show that the polishing of hard particles can effectively remove nodules and level the deposit, which leads to a brightening and smoothing deposition. Due to the perturbing of hard particles, the microstructure and property significantly change. The intensity of X-ray diffraction reduces, the degree of (200) preferential orientation decreases and that of (111) preferential orientation increases. The microhardness evidently increases from HV156 to HV221 and the corrosion resistance is improved by 20% in NaCl solution.
Key words: copper; hard particle; electroformation; electrodeposition; structure; property
