(吉林大学 材料科学与工程学院, 长春 130025)
摘 要: 研究了Bi、 Ag对Sn-9Zn无铅钎料系统润湿性、 接头力学性能及微观组织的影响。 结果表明: Sn-9Zn无铅钎料的润湿性较差, 添加适量的Bi有助于提高钎料的润湿性和接头剪切强度, 但同时也使接头的塑性降低; 添加适量的Ag能明显改善钎料的润湿性和接头塑性, 但Ag的质量分数超过1.5%时会降低钎料润湿性和接头剪切强度。 Sn-9Zn-Bi系无铅钎料组织由富Sn相、 富Zn相及Bi的析出物组成; Sn-9Zn-Ag系无铅钎料组织由富Sn相、 富Zn相及AgZn3化合物组成。
关键字: Sn-Zn无铅钎料; 微观组织; 润湿性能; 力学性能
( School of Materials Science and Engineering, Jilin University,
Changchun 130025, China)
Abstract: The influences of the addition of Bi, Ag to Sn-9Zn lead-free solder on the microstructure, wettability and mechanical properties were studied. The results show that Sn-9Zn lead-free solder has poor wettability. With the addition of Bi to Sn-9Zn lead-free solder, the improvement of wettability and shearing strength of joint can be achieved, but plasticity of joint decreases. With the addition of suitable amount Ag to Sn-9Zn lead-free solder, the improvement of wettability and plasticity of joint can be achieved obviously. With the addition of up to 1.5%Ag(mass fraction) to Sn-9Zn lead-free solder, the wettability and shearing strength of joint decreases. The micro-structures of Sn-9Zn-Bi solder system are composed of β-Sn matrix, Zn-rich phase and the precipitation of Bi phase in the β-Sn matrix. The microstructures of Sn-9Zn-Ag solder system are composed of β-Sn matrix, Zn-rich phase and AgZn3 intermetallic compound.
Key words: Sn-Zn lead-free solder; microstructure; wettability; mechanical properties