Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第18卷    第1期    总第106期    2008年1月

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文章编号:1004-0609(2008)01-0103-05
放电等离子烧结制备Zn-Cu-Sb-Bi合金的热电性能
毛立鼎1, 2,钱 欣1,崔教林2,陈东勇3

((1. 浙江工业大学 化学工程与材料学院,杭州 310014;2. 宁波工程学院 机械工程学院,宁波 315016;3. 中国矿业大学 材料科学与工程学院,徐州 221008))

摘 要: 采用真空熔炼/放电等离子烧结(SPS)方法制备PZn4−xCuxSb3−xBix(x=0~0.8)材料,研究该合金的组织结构和热电性能。结果表明,x0.2时,Zn4−xCuxSb3−xBix材料的Seebeck系数随x值增大而增大,当x=0.2时达到最大值;而当x0.2后,Seebeck系数又随x值增大而下降。在x=0.2487 K的条件下,Seebeck系数达到最大值,为249.2 mV/K。合金的电导率随CuBi含量增加而增大。借助Zn4-xCuxSb3的热扩散系数,计算得到材料的热导率随x值增大而增大;在574 Kx=0.4时,Zn4−xCuxSb3−xBix合金的最大热电优值(ZT)0.53,比同温度下b-Zn4Sb3合金的ZT值大0.07

 

关键字: Zn-Cu-Sb-Bi合金;共掺杂;热电性能;放电等离子烧结

Thermoelectric properties of Zn-Cu-Sb-Bi alloys prepared by spark plasma sintering
MAO Li-ding1, QIAN Xin1, CUI Jiao-lin2, CHEN Dong-yong3

(1. College of Chemical Engineering and Materials Science, Zhejiang University of Technology,Hangzhou 310014, China;2. School of Mechanical Engineering, Ningbo University of Technology, Ningbo 315016, China;3. School of Materials Science and Engineering, China University of Mining and Technology, Xuzhou 221008, China)

Abstract:P-type Zn4−xCuxSb3−xBix (x=0−0.8) alloys were prepared through vacuum melting and spark plasma sintering, and their structures were characterized. The results show that the Seebeck coefficient () increases with molar fraction (x) up to x=0.2 and then decreases, the electrical conductivity (σ) increases with increasing molar fraction x value. Considering the same fabrication technology of Zn4−xCuxSb3−xBix and Zn4−xCuxSb3 with the same x, the measured thermal diffusivities of Zn4−xCuxSb3 were used to calculate the thermal conductivities of Zn4−xCuxSb3−xBix. A relative enhancement of ZT is attained for Zn3.6Cu0.4Sb3.6Bi0.4, whose ZT is 0.53 at 574 K, about 0.07 higher than that of Zn4Sb3 at the same temperature.

 

Key words: Zn-Cu-Sb-Bi alloys; co-doping; thermoelectric properties; spark plasma sintering (SPS)

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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