(1. 福州大学 机械工程及自动化学院，福州 350108；2. 福州大学 材料研究所, 福州 350002)
摘 要:
关键字: 浸镀银；电沉积；置换反应
（1. College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China;2. Institute for Materials Research, Fuzhou University, Fuzhou 350002, China）
Abstract: The deposition rate and morphology of immersion silver plating onto copper substrate in silver nitrate aqueous solution were studied by galvanic current method and field emission scanning electron microscopy (FE-SEM). The results show that the whole deposition process can be divided into three stages：extending growth，transitional growth and dendritic growth. The deposition rate and morphology of Ag deposit are all different in each stage. Initially，the adhesive Ag atoms grow along the lattice of copper substrate. Secondly，the substrate is spread with initial silver crystal accompanied with two-dimension growth. Finally，coarse and sponge-like silver plating is prepared with dendritic growth.
Key words: immersion silver; electrodeposition; displacement
