(1. 大连理工大学 三束材料改性国家重点实验室，大连 116024；2. 大连理工大学 材料科学与工程学院，大连 116024)
摘 要:
关键字: Sn/Cu；金属间化合物层；时效；强磁场
（1. State Key Laboratory of Materials Modification by Laser, Ion and Electron Beams, Dalian University of Technology, Dalian 116024, China;2. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China）
Abstract:The growth behaviors of interfacial intermetallic compound (IMC) layers in soldered and diffusion bonding Sn/Cu joints during aging and the effect of high magnetic field were investigated. The results show that the cross sections and morphologies of IMC layers in soldered and diffusion-bonding joints before aging are different. The growth behaviors of these two IMC layers are similar when these joints are aged without magnetic field. The growth activation energies for the two IMC layers are 116 and 94 kJ/mol, respectively. In order to study the effect of high magnetic field on the growth behavior of IMC layers, the samples were aged at 190℃ in 8 T of high magnetic field strength. The results show that there exit unobvious difference between the growth kinetics of IMC layers in the two joints. However, the morphologies and orientations of IMC layers in these two joints change by high magnetic field.
Key words: Sn/Cu; intermetallic compound layers; aging; high magnetic field
