Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第18卷    第5期    总第110期    2008年5月

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文章编号:1004-0609(2008)05-0845-06
稀土元素在Cu-12%Ag合金中形成的化合物及对合金退火性能的影响
刘嘉斌1,张 雷2,孟 亮1

(1. 浙江大学 材料科学与工程系,杭州 310027;2. 北京科技大学 材料科学与工程学院,北京 100083)

摘 要: 采用冷拉拔结合中间热处理制备纤维复合Cu-12%AgCu-12%Ag-0.3%RE合金,在不同温度对合金进行退火,分析合金中稀土化合物形态与结构,研究合金组织性能在退火过程中的变化规律稀土元素的作用。结果表明:合金中初生富Cu枝晶及共晶体在拉拔过程中形成纤维复合组织,并在500 退火演变为等轴晶粒;随退火温度升高,合金强度下降而其电导率升高;添加0.3%的稀土元素能够在Cu-12%Ag合金中形成(Cu, Ag)6(Ce, La)化合物粒子,并可提高300 以下退火合金的抗软化能力,但使合金的电导率略为下降;(Cu, Ag)6(Ce, La)化合物粒子在拉拔过程中基本不变形,也不明显影响纤维组织退火时的再结晶行为。

 

关键词: 铜合金;稀土元素;退火;显微组织;强度;电导率

Effects of rare earth additions on compound structure and as-annealed properties of Cu-12%Ag
LIU Jia-bin1, ZHANG Lei2, MENG Liang1

1. Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; 2. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China

Abstract:Cu-12%Ag and Cu-12%Ag-0.3%RE alloys were manufactured by cold drawing combined with intermediate heat treatments. The drawn alloys were annealed at different temperatures. The morphology and structure of the compound particles in Cu-12%Ag-0.3%RE were examined. The changes of the microstructure and properties with annealing temperature and the effect of rare earth additions were investigated. The results show that the primary Cu-rich dendrites and eutectic colonies in the alloys evolve into filamentary structure during the drawing deformation. The filamentary structure changes into recrystallization structure of equiaxed grains during annealing at 500 ℃. The strength of the alloy decreases whereas the conductivity increases with increasing annealing temperature. Adding 0.3% rare earth elements into Cu-12%Ag alloys (Cu, Ag)6(Ce, La) compound particles form and the softening resistance in annealing are increased at temperatures lower than 300 ℃, whereas the conductivity are slightly decreased. The compound particles are hardly deformed during the drawing process and hardly influence the recrystallizaion behavior of the filamentary structure during the annealing process.

 

Key words: Cu alloy; rare earth element; annealing; microstructure; strength; electrical conductivity

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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