(北京科技大学 材料科学与工程学院，北京 100083)
摘 要: 制备硼硅酸盐玻璃包覆纯铜微丝，其主要尺寸范围为：铜丝直径4~30 µm，玻璃包覆层厚度2~8 µm；对微丝的耐腐蚀性能和电学性能进行评价。结果表明：玻璃包覆纯铜微丝在中性盐雾实验条件下，抗潮热盐雾腐蚀时间在240 h以上；对于外径25 μm、包覆层厚度3.2 μm和外径18 μm、包覆层厚度2.5 μm玻璃包覆纯铜微丝，平均击穿电压分别达到1 174 V和774 V，耐击穿电压分别在1 050 V和660 V以上；外径25 μm、包覆层厚度3.2 μm的玻璃包覆纯铜微丝抗软化击穿温度大于400 ℃。
关键字: 玻璃包覆纯铜微丝；盐雾腐蚀；击穿电压；软化击穿温度
（School of Materials Science and Engineering, University of Science and Technology Beijing, ）
Abstract:Abstract: The glass-coated pure copper microwires were prepared by self-designed experimental equipment. The copper fiber diameter was 4−30 µm and the thickness of glass-coated layer was 2−8 µm. The anti-corrosion and electrical properties of the microwires were also evaluated. The results show that the resisting salt spray corrosion time of the microwires is above 240 h in neutral salt spray test; the average breakdown voltages of the microwires with 25 μm in outer diameter and 3.2 μm in thickness of glass-coated layer and with 18 μm in outer diameter and 2.3 μm in thickness of glass-coated layer are 1 174 V and 774 V, respectively; the anti-breakdown voltages are above 1 050 V and 660 V; the cut through temperature of the microwire with 25 μm in outer diameter and 3.2 μm in thickness of glass-coated layer is above 400 ℃.
Key words: glass-coated pure copper microwire; salt spray test; breakdown voltage; cut through temperature
