(1. 东南大学 材料科学与工程学院，南京 211189；2. 河海大学 材料科学与工程学院，南京 210098)
摘 要: 以纯Al 粉为渗剂、NHCl4作为活化剂、鸡蛋清为粘结剂、Cu基体镀Ni层表面渗Al。研究经800 ℃保温12 h后的渗铝层的表面形貌、组织、厚度和截面元素分布，分析渗铝过程的机理。结果表明：渗铝处理后Cu-Ni界面结合良好。渗铝层组织为单一的富Al的Ni2Al3金属间化合物。渗铝层厚度为200 μm，平均显微硬度HV达到1 100。Al的沉积和运输主要依靠AlCl2完成。
关键字: 铜；电镀；镍；Ni2Al3金属间化合物；浆料包渗法
（1. School of Materials Science and Engineering, Southeast University,Nanjing 211189, China;2. School of Materials Science and Engineering, Hohai University,Nanjing 210098, China）
Abstract:The surface of the electro-deposited nickel layer on copper matrix was aluminized by a slurry pack cementation process. Using aluminum powders as doner, NH4Cl as the activator and albumen (egg white) as the cohesive agent. The surface morphology, the thickness，the phases and the elements distribution in the cross-section of aluminized layer fabricated at 800 ℃ for 12 h were studied, and the aluminizing mechanism was discussed. The results show that the interface of the Cu/Ni is bound excellently after aluminization. The microstructure of the aluminized layer is a single-phase Ni-rich Ni2Al3 intermetallic compound. The thickness of aluminized coating was 200 μm. The average micro hardness of the aluminized layer is HV 1 100. AlCl2 is responsible for the transportation and deposition of Al in the slurry pack.
Key words: copper; electro-deposition; nickel; Ni2Al3 intermetallic compound; slurry pack cementation
