Sn-9Zn钎料与内加Cu质点和Cu基体界面生长行为|卫国强,况敏,杨永强,赵利-《中国有色金属学报》官方网站|全网首发|论文开放获取

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第17卷第7期总第100期 2007年7月

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文章编号：1004-0609(2007)07-1083-07

Sn-9Zn钎料与内加Cu质点和Cu基体界面生长行为

卫国强1，况敏2，杨永强1，赵利2

(1. 华南理工大学机械工程学院，广州 510641；
2. 广州有色金属研究院材料表面中心，广州 510651)

摘要:

在Sn-9Zn无铅钎料中加入Cu金属质点，研究在长时间钎焊条件下钎料/Cu质点、钎料/Cu基体界面金属间化合物(IMCs)的生长行为。结果表明：在钎料/Cu质点和钎料/Cu基体界面处都生成Cu-Zn相(IMCs)，其组成为Cu₅Zn₈+CuZn或Cu₅Zn₈，而且钎料/质点界面处IMCs的生长速度明显快于钎料/基体处；同时发现，Cu质点的加入大大减小了钎料/Cu基体界面IMCs的厚度。由于Cu质点原位生成Cu-Zn IMCs，消耗了焊点中的Zn，因此Sn-9Zn/Cu接头的可靠性得以提高。

关键字: Sn-9Zn 钎料；无铅钎料；Cu质点；金属间化合物

Interfacial growth behavior of Sn-9Zn/additive Cu-particles
and Sn-9Zn/Cu-substrate

WEI Guo-qiang1, KUANG Min2, YANG Yong-qiang1, ZHAO Li2

（1. College of Mechanical Engineering, South China University of Technology,
Guangzhou 510641, China;
2. Materials Surface Centre, Guangzhou Research Institute of Nonferrous Metals, Guangzhou 510651, China）

Abstract:The growth behavior of interfacial intermetallic compounds (IMCs) of Sn-9Zn/additive Cu-particles and Sn-9Zn additive Cu-substrate was investigated under the condition of extended soldering time. The results show that the Cu-Zn phases, which are composed of Cu5Zn8 and CuZn or Cu5Zn8, are formed at the interfaces of both Sn-9Zn/Cu-particles and Sn-9Zn/Cu-substrate, simultaneously the growth rate of IMCs of Sn-9Zn/Cu-particles is markedly higher than that of Sn-9Zn/Cu-substrate. It is also shown that the addition of Cu-particles in Sn-9Zn solder greatly reduces the thickness of IMCs layer of Sn-9Zn/Cu-substrate. The reliability for Sn-9Zn/Cu joint is improved for the diminished Zn content in soldering joint due to the in-situ formation of IMCs of Sn-9Zn/Cu-particles.

Key words: Sn-9Zn solder; lead-free solder; Cu-particle; intermetallic compound (IMCs)

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW