Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

您目前所在的位置:首页 - 期刊简介 - 详细页面

中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第17卷    第8期    总第101期    2007年8月

[PDF全文下载]        

    

文章编号:1004-0609(2007)08-1302-05
Cu对Sn-9Zn无铅钎料电化学腐蚀性能的影响
樊志罡,马海涛,王 来

(大连理工大学 材料科学与工程学院,大连 116024)

摘 要: Sn-9Zn-xCu钎料在3.5%NaCl溶液中的电化学腐蚀行为进行研究,以揭示添加CuSn-9Zn钎料耐蚀性的影响。结果表明:添加Cu元素使Sn-Zn钎料的腐蚀电位有所增加,即添加Cu元素可以改善Sn-Zn钎料的耐腐蚀性能;XRD检测发现Sn-9Zn-xCu钎料的腐蚀产物中存在Zn5(OH)8Cl2∙H2O;随着Cu含量的增加,Zn5(OH)8Cl2∙H2O的量逐渐减少,出现Cu的腐蚀产物,腐蚀表面趋于均匀平整,选择性腐蚀减弱,腐蚀产物的黏附性较好。

 

关键字: 无铅钎料;Sn-Zn-Cu钎料;NaCl溶液;电化学腐蚀

Effect of Cu on electrochemical corrosion behavior of lead-free Sn-9Zn-xCu solder
FAN Zhi-gang, MA Hai-tao, WANG Lai

School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China

Abstract:The electrochemical corrosion behavior of lead-free Sn-9Zn-xCu(x=0−6) solder in 3.5% NaCl solution was studied, in order to reveal the effect of Cu on the corrosion resistance of Sn-9Zn solder. The results indicate that the corrosion potential increases with increasing the addition of Cu, so Cu can improve the corrosion resistance of Sn-Zn solders. XRD results indicate that Zn5(OH)8Cl2∙H2O exists in the corrosion products of Sn-9Zn-xCu. With increasing Cu content, the quantity of Zn5 (OH)8Cl2∙H2O decreases, the corrosion products containing Cu form, the surface tends to be smooth, and the selective oxidation weakens.

 

Key words: free-lead solder; Sn-Zn-Cu solder; NaCl solution; electrochemical corrosion

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中国科学技术协会 主办:中国有色金属学会 承办:中南大学
湘ICP备09001153号 版权所有:《中国有色金属学报》编辑部
------------------------------------------------------------------------------------------
地 址:湖南省长沙市岳麓山中南大学内 邮编:410083
电 话:0731-88876765,88877197,88830410   传真:0731-88877197   电子邮箱:f_ysxb@163.com