(大连理工大学 材料科学与工程学院,大连 116024)
摘 要: 对Sn-9Zn-xCu钎料在3.5%NaCl溶液中的电化学腐蚀行为进行研究,以揭示添加Cu对Sn-9Zn钎料耐蚀性的影响。结果表明:添加Cu元素使Sn-Zn钎料的腐蚀电位有所增加,即添加Cu元素可以改善Sn-Zn钎料的耐腐蚀性能;XRD检测发现Sn-9Zn-xCu钎料的腐蚀产物中存在Zn5(OH)8Cl2∙H2O;随着Cu含量的增加,Zn5(OH)8Cl2∙H2O的量逐渐减少,出现Cu的腐蚀产物,腐蚀表面趋于均匀平整,选择性腐蚀减弱,腐蚀产物的黏附性较好。
关键字: 无铅钎料;Sn-Zn-Cu钎料;NaCl溶液;电化学腐蚀
(School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China)
Abstract:The electrochemical corrosion behavior of lead-free Sn-9Zn-xCu(x=0−6) solder in 3.5% NaCl solution was studied, in order to reveal the effect of Cu on the corrosion resistance of Sn-9Zn solder. The results indicate that the corrosion potential increases with increasing the addition of Cu, so Cu can improve the corrosion resistance of Sn-Zn solders. XRD results indicate that Zn5(OH)8Cl2∙H2O exists in the corrosion products of Sn-9Zn-xCu. With increasing Cu content, the quantity of Zn5 (OH)8Cl2∙H2O decreases, the corrosion products containing Cu form, the surface tends to be smooth, and the selective oxidation weakens.
Key words: free-lead solder; Sn-Zn-Cu solder; NaCl solution; electrochemical corrosion