中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 21 No. 9 September 2011 |
（1. School of Mechanical and Electric Engineering, Guangzhou University, Guangzhou 510006, China;
2. School of Mechanical and Automotive Engineering, South China University of Technology,
Guangzhou 510640, China）
Abstract:A novel phase change heat sink was fabricated for packaging cooling of high power light emitting diode (LED). 3D structures as enhanced boiling structure in the evaporation surface were composed of a spiral micro-groove along circumferential direction and radial micro-grooves which were processed by ploughing-extrusion (P-E) and stamping, respectively. Meanwhile, the cycle power of refrigerant was supplied by wick of sintered copper powder on internal surface of phase change heat sink. Operational characteristics were tested under different heat loads and refrigerants. The experimental results show that phase change heat sink is provided with a good heat transfer capability and the temperature of phase change heat sink reaches 86.8 °C under input power of 10 W LED at ambient temperature of 20 °C.
Key words: high power light emitting diode; phase change heat sink; enhanced boiling; wick; heat transfer performance
