Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 21    No. 5    May 2011

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Low-temperature purification process of metallurgical silicon
ZHAO Li-xin1, 2, WANG Zhi1, GUO Zhan-cheng1, 3, LI Cheng-yi4

1. National Engineering Laboratory for Hydrometallurgical Cleaner Production Technology,
Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China;
2. Graduate University of Chinese Academy of Sciences, Beijing 100049, China;
3. State Key Laboratory of Advanced Metallurgy,
University of Science and Technology Beijing, Beijing 100083, China;
4. School of Chemical and Environmental Engineering,
China University of Mining and Technology, Beijing 100083, China

Abstract:The removal of B and P consumes most of heat energy in Si metallurgical purification process for solar-grade Si. Metal-liquating purification of metallurgical grade silicon (MG-Si), also called Si-recrystallization from metal liquid, was a potential energy-saving method for the removal of B and P efficiently, since Si could be melted at lower temperature by alloying with metal. The selection criteria of metal-liquating system was elaborated, and Al, Sn and In were selected out as the optimum metallic mediums. For Sn-Si system, the segregation coefficient of B decreased to 0.038 at 1 500 K, which was much less than 0.8 at the melting point of Si. The mass fraction of B was diminished from 15×10−6 to 0.1×10−6 as MG-Si was purified by twice, while that of most metallic elements could be decreased to 0.1×10−6 by purifying just once. During the metal-liquating process, the formation of compounds between impurity elements and Si was also an important route of impurity removal. Finally, one low-temperature metallurgical process based on metal-liquating method was proposed.

 

Key words: metal liquating method; metallurgical purification process; tin-silicon system; solar grade silicon

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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