中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 21 Special 1 March 2011 |
anisotropic conductive paste hybrid material
（1. Advanced Joining Technology Team/Microjoining Center, Korea Institute of Industrial Technology(KITECH),
Yeonsu-gu, Incheon 406-840, Korea;
2. School of Materials Science & Engineering, Inha University, Incheon 402-020, Korea;
3. Department of Materials Science & Engineering, Pusan National University, Busan 609-735, Korea;
4. Department of Materials Science & Engineering, Seoul National University of Technology, Seoul 139-743, Korea）
Abstract:A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(RFID) inlay. The optimization condition for flip-chip bonding was determined from the behavior of bonding strength. Under the optimized condition, the shear strength for the antenna printed with paste-type Ag ink was larger than that for Cu antenna. Furthermore, an identification distance was varied from the antenna materials. Comparing with the Ag antenna pattern, the as-bonded die on Cu antenna showed a larger distance of identification. However, the long-term reliability of inlay using the Cu antenna was decreased significantly as a function of aging time at room temperature because of the bended shape of Cu antenna formed during the flip-chip bonding process.
Key words: RFID inlay; ACP; flip-chip, bonding process; reliability
