中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 20 No. 9 September 2010 |
（1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;
2. East China Research Institute of Electronic Engineering, Hefei 230088, China）
Abstract:Based on the research of modern electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process of thixo-extrusion with SiCp/A356 composites was simulated by the finite element software DEFORM-3D, then the flow velocity field, equivalent strain field and temperature field were analyzed. The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation. The results show that thixo-forming technology can be used in producing electronic package shell with SiCp/A356 composites, and high volume fraction of SiCp with homogeneous distribution can be achieved, being in agreement with the requirements of electronic packaging materials.
Key words: thixo-forming; SiCp/A356 composites; electronic packaging shell; numerical simulation
