中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
Vol. 10 No. 3 June 2000 |
cracking in TiN thin films①
(School of Materials Science and Engineering, ShanghaiJiaotong University,
Shanghai200030, P.R.China)
Abstract:The influence of a gradient interlayer on the residual stress and cracking in TiN thin films was studied as a function of the thickness of gradient interlayer. Both X-ray in-situ tensile testing and grazing method were used to measure the residual stress in thin films. In TiN films, there exists a residual stress of 10GPa, which can be remarkably decreased by a gradient interlayer between film and substrate. The cracking behavior of films after tension shows that the crack of film/substrate system begins at interface between film and substrate.
Key words: TiN thin film; residual stress; gradient interlayer.