Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 19    Special 3    December 2009

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Heat shock behavior of permanent die during
non-solid near-net forming process
ZHANG Mi-lan(张密兰)1,2, SHAN Zhong-de(单忠德)1, XING Shu-ming(邢书明)3,
JIANG Chao(姜 超)1, XU Ying(许 应)1

1. State Key Laboratory of Advanced Forming Technology and Equipment, Advanced Manufacture Technology Center, China Academy of Machinery Science and Technology, Beijing 100083, China;
2. School of Mechanical and Engineering, University of Science and Technology Beijing, Beijing 100083, China;
3. School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing 100044, China

Abstract:Heat shocks caused by alloy melt and coat spraying are the main reason of die plastic deformation and early fracture. Based on theoretical analysis of heat shock phenomenon, two characteristic parameters of die damage caused by heat shock were proposed, which are heat shock plastic deformation index (HSPI) and heat shock crack index (HSCI). The effect of heat shock on die plastic deformation and fracture behaviors was described quantitatively by these two parameters. HSPI represents approaching of heat shock stress to die yield stress. Plastic deformation will happen on a die if this index reaches 1. HSCI represents approaching of heat shock stress to die tensile strength. Die fracture will happen if this index reaches 1. According to theoretical analysis of heat transfer, theoretical models of HSPI and HSCI were established. It is found that, the smaller the interfacial thermal resistance (ITR) is, the higher the pouring temperature and die temperature are before heat shock, and the greater the HSPI and HSCI are, which can be fitted as exponential curves, linear and cubic curves.

 

Key words: non-solid near-net forming; die; heat shock; heat shock plastic deformation index; heat shock crack index

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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