中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 12 No. 1 February 2002 |
chemical mechanical polishing of
copper in K3Fe(CN)6 solution
（1.College of Chemistry and Chemical Engineering,
Central South University,Changsha 410083,China;
2.Department of Mineral Engineering,
Central South University,Changsha 410083,China）
Abstract:Polarization curves of copper were measured in NH3·H2O media containing K3Fe(CN)6.Components of passive film were analyzed by XPS.Relation of polishing rate with corrosion current density was investigated during CMP.Copper can bepassivated in the slurry and main component of passive film is Cu4Fe(CN)6. Relation of polishing rate with corrosion current density is linear direct ratio and expressed as R=KJcorr during CMP.Coefficient K varies with different slurry systems but is constant under experimental conditions,which does not vary with NH3·H2O,K3Fe(CN)6,γ-Al2O3 concentrations, polishing pressures and rotative rate in aslurry system during CMP.
Key words: copper; polishing rate; corrosion current density
