中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 11 No. 6 December 2001 |
Numeric simulation of thickness of intermetallic compounds in
interface zone of diffusion bonding for Cu and Al
interface zone of diffusion bonding for Cu and Al
（Key Lab of Liquid Structure and Heredity of Materials, Ministry of Education,
School of Materials Science and Engineering, Shandong University, Jinan 250061, P.R.China）
Abstract: Numeric model of intermetallic compound formation and growth in the vacuum diffusion bonding of copper and aluminum was established, and proved by EPMA and micro-hardness test etc. The numeric simulation of thickness of the intermetallic compound results in accord with the tests well. This study provides some references to determine welding parameters in the vacuum diffusion bonding of Cu/Al dissimilar materials.
Key words: vacuum diffusion bonding; intermetallic compounds; numeric simulation
