中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 11 No. 2 April 2001 |
electrical property of CuZn alloy
（1. School of Materials Science and Engineering,
Beijing Polytechnic University, Beijing 100022, P.R.China;
2. Department of Materials Science and Engineering,
Central South University, Changsha 410083, P.R.China）
Abstract:The relationship among annealing temperature, microstructure and electrical resistivity of Cu-(8%～13%)Zn (mole fraction) alloys was studied. The results show that the relationship between the electrical resistivity of cold deformation CuZn alloy and annealing temperature is related to the recovery and recrystallization of the processes. The increments of electrical resistivity due to strain are restored mainly on the process of recovery and recrystallization. The room temperature resistivity of soft state alloys is linear to the Zn contents. The extended application of Matthissen rule on high concentration solid solution was discussed.
Key words: CuZn alloy; electrical resistivity; recovery recrystallization
