中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 15 No. 2 April 2005 |
（1. School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China;
2. Institute for Materials Research, GKSS Research Center Geesthacht,
Geesthacht D-21502, Germany）
Abstract: The interface evolution of TiAl/Ti6242 joint produced by transient liquid phase(TLP) bonding with Ti, Cu foils as insert metals was investigated. The results show that the surface oxide layer on TiAl plays a very important role in the formation process of the joint. A ‘bridge’ effect is observed because of the presence of the oxide layer on the surface of TiAl. The diffusion behavior of Cu atoms in TiAl is strongly controlled by the vacancies beneath the surface of TiAl. Based on the interface diffusion and interface wettability, a mechanism for the effect of bonding pressure, bonding temperature, holding time and stacking sequence of the insert foils on the joint formation process were proposed.
Key words: TiAl; Ti6242 transient liquid phase bonding; intermetallics; interface evolution; mechanism
