中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 14 No. 3 June 2004 |
welding interface for ZCuBe2.5 Alloy①
（1. School of Materials Science and Engineering, Xi′an University of Technology, Xi′an 710048, China;
2. School of Materials Science and Engineering, Chongqing University, Chongqing 430044, China）
Abstract:The microstructures and properties of liquid film solution-diffusion welding interface for ZCuBe2.5 alloy have been studied using Cu-base powder. It reveals that the welding joint has high tensile strength up to 278 MPa, rational distribution of hardness and better matches with base materials in properties. Weld metal consists of the uniform and fineαCu equiaxed grain and intergranular Cu5.6Sn phase. The weld is well combined with base materials. The transition solid
solution combination interface with a thickness of 150μm has been formed. In the process of stable welding, the thickness of interface appears to have an increase linearly with bonding time. In the cases of same bonding time, the thickness of interface increases with an increase of temperature gradient, which will become even more apparent with the increase of
bonding time.
Key words: liquid film solution-diffusion welding; Cu-based alloy powder; ZCuBe2.5; microstructure; properties
