中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 17 No. 4 August 2007 |
（1. College of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China;
2. Joining and Welding Research Institute, Osaka University, Ibalaki, Osaka 567-0047, Japan）
Abstract:The effects of Ni content, soldering temperature and time on the IMC thickness in Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.2Co alloys were researched using uniform design method and computer programs. For each alloy, the factors were divided into three levels in the experiment. Two correlative equations are given by regression. They indicate that the effects of three factors on the function are in the mutual and quadratic forms. And the analysis of variance shows the equations are sound and meaningful. Using the equations, it is easy to search, predict and control the IMC thickness. The existence of element Co accelerates the crystallization and growing up of IMC.
Key words: lead-free solder; Sn-Ag-Cu alloy; IMC thickness; uniform design
