Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 36    No. 2    February 2026

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Effects of modulation layer thickness on microstructures and mechanical behavior of VN/TiN-Ni nano-multilayered films
Wen-jie CHENG a,b, Ping LIU b, Xin-fa ZHU c, Yi MENG c, Hong-mei LU c, Peter K. LIAW d, Wei LI b,*

a Center for Research on the Preparation and Properties of New Functional Materials, School of Physics and Electronic Engineering, Hanjiang Normal University, Shiyan 442000, China;
b School of Materials and Chemistry, University of Shanghai for Science and Technology, Shanghai 200093, China;
c Shanghai Tool Factory Company Limited, Shanghai 200093, China;
d Department of Materials Science and Engineering, The University of Tennessee, Knoxville TN 37996, USA

Abstract:The dependence of interface structure and mechanical properties on the modulation layer thickness of VN/TiN-Ni nano-multilayered films deposited on Si substrates using a reactive magnetron sputtering technique was systematically investigated. The films were characterized using X-ray diffraction, scanning electron microscopy, X-ray photoelectron spectroscopy, transmission electron microscopy, and nanoindentation. The results show that the TiN-Ni layer grows epitaxially on the VN layer, forming a coherent interface between the two sublayers. When the deposition time ratio of the two sublayers (TTiN-Ni?TVN) is 10?12, the films exhibit remarkable mechanical properties, with hardness, elastic modulus, and fracture toughness values of 25.9 GPa, 317 GPa, and 1.88 MPa·m1/2, respectively. Meanwhile, fracture toughness is improved by approximately 50% compared to the VN monolithic film. This enhancement is attributed to the coherent interface between the sublayers and the phase separation in the TiN-Ni layer.

 

Key words: nano-multilayered film; modulation-layer thickness; phase separation; strengthening; fracture toughness

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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