Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 35    No. 12    December 2025

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Influence mechanism of reduction rate on interface microstructure and mechanical properties of TA1/TC4 composite plate
Peng ZHANG1,2,3, Hao ZHAO2,3,4, Jin-zhou ZHU1,3,4, Tao WANG2,3,4, Zhong-kai REN2,3,4, Jian-chao HAN2,3,4, Wen-wen LIU2,3,4

1. College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024, China;
2. National Key Laboratory of Metal Forming Technology and Heavy Equipment, Taiyuan University of Technology, Taiyuan 030024, China;
3. Engineering Research Center of Advanced Metal Composites Forming Technology and Equipment, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024, China;
4. College of Mechanical Engineering, Taiyuan University of Technology, Taiyuan 030024, China

Abstract:The effects of the reduction rate of the corrugated rolling on the microstructure and mechanical properties of TA1/TC4 composite plate that was prepared via corrugated rolling + flat rolling process were investigated. The finite element model was developed and validated for the corrugated rolling process of the composite plate. Experimental findings reveal the absence of significant defects and intermetallic compounds at the bonding interface. When the rolling temperature is 700 °C with the reduction rate of 44% in the first pass of corrugated rolling, the tensile and interfacial shear strengths of the composite plate reach 749 and 403.97 MPa, respectively. The simulation results demonstrate that the plastic strain in the TC4 substrate is enhanced by corrugated rolling and the compressive stress at the trough is high. These results confirm that interfacial bonding is promoted by corrugated rolling, and the mechanical properties of the composite plate are improved significantly with the increase of reduction rate.

 

Key words: corrugated rolling; TA1/TC4 composite plate; reduction rate; interface microstructure; interface bonding properties

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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