中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 35 No. 3 March 2025 |
（1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China;
2. Institute of Materials, Henan Academy of Sciences, Zhengzhou 450046, China;
3. Provincial and Ministerial Co-construction of Collaborative Innovation Center of Nonferrous New Materials and Advanced Processing Technology, Luoyang 471023, China）
Abstract:The effects of trace cerium (Ce) addition on the microstructural and textural evolution and the dynamic recrystallization (DRX) of the ultrahigh-purity copper (Cu) containing small amounts of sulfur (S) were investigated using a Gleeble-1500 thermal simulation tester at 600 °C. The results show that with increasing Ce content, the grain size of the Cu-S (S2) alloy gradually decreases and the grain boundary embrittlement induced by S impurities is considerably inhibited. The addition of Ce promotes the DRX process of the S2 alloy and changes its DRX mechanism from discontinuous to continuous and twinning-induced DRX mechanisms. The texture component and intensity of the S2 alloy vary with the increase of Ce content. The addition of 120×10-6 Ce (mass fraction) is favorable for the grain orientation randomization, which is attributed to the promoted DRX.
Key words: Ce addition; S impurities; ultrahigh-purity copper; microstructure; dynamic recrystallization; texture
