Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 34    No. 12    December 2024

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Additive manufacturing of pure copper via vat photopolymerization with slurry
An-liang YE1, Meng WANG1, Yan-bin JIANG1, Xiao-zan WU1, Chao-qun PENG1, Jin HE2, Xiao-feng WANG1,3

1. School of Materials Science and Engineering, Central South University, Changsha 410083, China;
2. Key Laboratory of Materials for High Power Lasers, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China;
3. State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China

Abstract:Stereolithography (SLA) combined with a two-step post-processing method “oxidation-reduction” was developed to fabricate pure copper with high complexity. The copper slurries for SLA were prepared, and particularly the influence of volume fraction of copper on the properties of copper slurries was investigated. In the two-step post-treatment process, organics were removed by oxidation and copper powder was oxidized simultaneously, and then the oxidized copper was reduced into highly reactive copper particles, improving the sintering activity of the copper green body and enhancing the relative density of the sintered part. The results show that curing depth of the copper slurries decreased with the increase of volume fraction of copper. The viscosity of the pure copper slurry rises exponentially as the volume fraction of copper exceeded 50%. The highest volume fraction of pure copper slurry for SLA is 55%. The specimens exhibited an increase in hardness and electrical conductivity with the increase of volume fraction of copper. Specifically, the maximum values of hardness and conductivity of samples with 55 vol.% copper were HV 52.7 and 57.1%(IACS), respectively.

 

Key words: pure copper; additive manufacturing; stereolithography; complex structure parts; copper slurry

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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