中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 34 No. 10 October 2024 |
（1. School of Mechanical Engineering, Tianjin University of Technology and Education, Tianjin 300222, China;
2. Tianjin Key Laboratory of Materials Laminating Fabrication and Interface Control Technology, School of Materials Science and Engineering, Hebei University of Technology, Tianjin 300130, China;
3. School of Materials Science and Engineering, Central South University, Changsha 410083, China;
4. Institute of New Materials, Guangdong Academy of Sciences, Guangzhou 510651, China）
Abstract:In order to improve the comprehensive properties of the Cu-11.9Al-2.5Mn shape memory alloy (SMA), multilayer graphene (MLG) carried by Cu51Zr14 inoculant particles was incorporated and dispersed into this alloy through preparing the preform of the cold-pressed MLG-Cu51Zr14 composite powders. In the resultant novel MLG/Cu-Al-Mn composites, MLG in fragmented or flocculent form has a good bonding with the Cu-Al-Mn matrix. MLG can prevent the coarsening of grains of the Cu-Al-Mn SMA and cause thermal mismatch dislocations near the MLG/Cu-Al-Mn interfaces. The damping and mechanical properties of the MLG/Cu-Al-Mn composites are significantly improved. When the content of MLG reaches 0.2 wt.%, the highest room temperature damping of 0.0558, tensile strength of 801.5 MPa, elongation of 10.8%, and hardness of HV 308 can be obtained. On the basis of in-depth observation of microstructures, combined with the theory of internal friction and strengthening and toughening theories of metals, the relevant mechanisms are discussed.
Key words: Cu-Al-Mn shape memory alloy; multilayer graphene (MLG); microstructure; interface; damping; mechanical properties
