中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 34 No. 1 January 2024 |
（1. National Engineering Research Center of Light Alloy Net Forming, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
2. AVIC Aeronautical Radio Electronics Research Institute, Shanghai 200233, China）
Abstract:To improve the strength of Al alloys without severely deteriorating the thermal conductivity, the Cu/Al bimetallic composite comprising penetration architecture was artificially designed and fabricated via the additive manufacturing combined with the squeeze casting. The composite exhibited a good balance of the strength (~340 MPa) and thermal conductivity (200 W/(m·K)), outperforming the traditional Al alloys. High thermal conduction is attributed to the geometrical Cu scaffold, which provides a rapid pathway for the electron conduction. Simultaneously, the good metallurgical bonding is attained by the formation of the Al2Cu eutectic phase along the interfaces, which effectively enhances the strength of the Cu/Al composite.
Key words: Cu/Al composites; compressive strength; squeeze casting technology; thermal conductivity
