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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第28卷    第3期    总第228期    2018年3月

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文章编号:1004-0609(2018)-03-0547-09
高强高导Cu-Mg-Ca合金加工过程中组织结构演变
李亚萍1,肖 柱1,雷 前1,周哲远1,李 周1, 2

(1. 中南大学 材料科学与工程学院,长沙 410083; 2. 粉末冶金国家重点实验室,长沙 410083)

摘 要: 利用硬度计、双臂电桥、金相显微镜、透射电镜和背散射电子衍射观察等技术研究Cu-0.3Mg-0.16Ca(质量分数,%)合金在加工过程中组织结构的演变规律及性能变化。结果表明:设计合金经780 ℃、1 h固溶处理后冷轧变形状80%时,硬度为167HV,抗拉强度为545 MPa,电导率70.24%IACS;当变形量达到90%时,硬度为174HV,抗拉强度为600 MPa,电导率为68.68%IACS,均高于同状态下的高铁接触线用CTMH型Cu-0.4Mg合金的性能。设计合金固溶态组织为以大角度晶界为主的等轴晶,所占比例最高的是60°的大角度晶界;随着冷变形的进行,合金组织中开始出现分布不均匀的小角度晶界,随着变形量的进一步增加,小角度晶界先增多后减少。当变形量达到80%时,合金轧面的变形织构以S剪切织构和Copper织构为主,此时合金显微组织中的变形条带发生弯曲,向胞状组织过渡。

 

关键字: Cu-Mg-Ca合金;高强度;高电导率;显微组织

Microstructure and mechanical properties evolution of high strength and high electrical conductivity Cu-Mg-Ca alloy during manufacture process
LI Ya-ping1, XIAO Zhu1, LEI Qian1, ZHOU Zhe-yuan1, LI Zhou1, 2

1. School of Materials Science and Engineering, Central South University, Changsha 410083, China; 2. State Key Laboratory of Powder Metallurgy, Changsha 410083, China

Abstract:The microstructure evolution of the designed Cu-0.3Mg-0.16Ca (mass fraction, %) alloy was studied by metallographic microscopy, transmission electron microscopy and electron backscattered diffractometry. The result shows that, after being homogenized at 780 ℃ for 1 h, followed by cold rolling with a reduction of 80%, the designed alloy shows prospective comprehensive properties with tensile strength of 545 MPa and electrical conductivity of 70.24%IACS. When being cold-rolled to 90% reduction, the tensile strength and electrical conductivity of Cu-0.3Mg-0.16Ca (mass fraction, %) alloy approach 600 MPa and 68.68%IACS, respectively, which are both higher than those of CTMH Cu-0.4Mg alloy that is commonly used in high-speed railway contact wires. The fraction of low-angle grain boundaries of the alloy increases and then decreases with the increase of deformation. After a cold rolling reduction of 80%, the textures of S and Copper are predominatant.

 

Key words: Cu-Mg-Ca alloy; high strength; high electrical conductivity; microstructure

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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