Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第16卷    第1期    总第82期    2006年1月

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文章编号: 1004-0609(2006)01-0158-06
Bi、Ag对Sn-Zn无铅钎料性能与组织的影响
吴文云, 邱小明, 殷世强, 孙大谦, 李明高

(吉林大学 材料科学与工程学院, 长春 130025)

摘 要:  研究了Bi、 Ag对Sn-9Zn无铅钎料系统润湿性、 接头力学性能及微观组织的影响。 结果表明: Sn-9Zn无铅钎料的润湿性较差, 添加适量的Bi有助于提高钎料的润湿性和接头剪切强度, 但同时也使接头的塑性降低; 添加适量的Ag能明显改善钎料的润湿性和接头塑性, 但Ag的质量分数超过1.5%时会降低钎料润湿性和接头剪切强度。 Sn-9Zn-Bi系无铅钎料组织由富Sn相、 富Zn相及Bi的析出物组成; Sn-9Zn-Ag系无铅钎料组织由富Sn相、 富Zn相及AgZn3化合物组成。

 

关键字:  Sn-Zn无铅钎料; 微观组织; 润湿性能; 力学性能

Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free solder
WU Wen-yun, QIU Xiao-ming, YIN Shi-qiang, SUN Da-qian, LI Ming-gao

School of Materials Science and Engineering, Jilin University,
 Changchun 130025, China

Abstract: The influences of the addition of Bi, Ag to Sn-9Zn lead-free solder on the microstructure, wettability and mechanical properties were studied. The results show that Sn-9Zn lead-free solder has poor wettability. With the addition of Bi to Sn-9Zn lead-free solder, the improvement of wettability and shearing strength of joint can be achieved, but plasticity of joint decreases. With the addition of suitable amount Ag to Sn-9Zn lead-free solder, the improvement of wettability and plasticity of joint can be achieved obviously. With the addition of up to 1.5%Ag(mass fraction) to Sn-9Zn lead-free solder, the wettability and shearing strength of joint decreases. The micro-structures of Sn-9Zn-Bi solder system are composed of β-Sn matrix, Zn-rich phase and the precipitation of Bi phase in the β-Sn matrix. The microstructures of Sn-9Zn-Ag solder system are composed of β-Sn matrix, Zn-rich phase and AgZn3 intermetallic compound.

 

Key words: Sn-Zn lead-free solder; microstructure; wettability; mechanical properties

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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