Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

您目前所在的位置:首页 - 期刊简介 - 详细页面


Transactions of Nonferrous Metals Society of China

Vol. 21    Special 1    March 2011

[PDF Download]    [Flash Online]


Reliability of flip-chip bonded RFID die using
anisotropic conductive paste hybrid material
Jun-Sik LEE1, Jun-Ki KIM1, Mok-Soon KIM2, Namhyun KANG3, Jong-Hyun LEE4

1. Advanced Joining Technology Team/Microjoining Center, Korea Institute of Industrial Technology(KITECH),
Yeonsu-gu, Incheon 406-840, Korea;
2. School of Materials Science & Engineering, Inha University, Incheon 402-020, Korea;
3. Department of Materials Science & Engineering, Pusan National University, Busan 609-735, Korea;
4. Department of Materials Science & Engineering, Seoul National University of Technology, Seoul 139-743, Korea

Abstract:A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(RFID) inlay. The optimization condition for flip-chip bonding was determined from the behavior of bonding strength. Under the optimized condition, the shear strength for the antenna printed with paste-type Ag ink was larger than that for Cu antenna. Furthermore, an identification distance was varied from the antenna materials. Comparing with the Ag antenna pattern, the as-bonded die on Cu antenna showed a larger distance of identification. However, the long-term reliability of inlay using the Cu antenna was decreased significantly as a function of aging time at room temperature because of the bended shape of Cu antenna formed during the flip-chip bonding process.


Key words: RFID inlay; ACP; flip-chip, bonding process; reliability

ISSN 1004-0609
CN 43-1238/TG

ISSN 1003-6326
CN 43-1239/TG

主管:中国科学技术协会 主办:中国有色金属学会 承办:中南大学
湘ICP备09001153号 版权所有:《中国有色金属学报》编辑部
地 址:湖南省长沙市岳麓山中南大学内 邮编:410083
电 话:0731-88876765,88877197,88830410   传真:0731-88877197   电子邮箱