Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 21    Special 1    March 2011

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Reliability of flip-chip bonded RFID die using
anisotropic conductive paste hybrid material
Jun-Sik LEE1, Jun-Ki KIM1, Mok-Soon KIM2, Namhyun KANG3, Jong-Hyun LEE4

1. Advanced Joining Technology Team/Microjoining Center, Korea Institute of Industrial Technology(KITECH),
Yeonsu-gu, Incheon 406-840, Korea;
2. School of Materials Science & Engineering, Inha University, Incheon 402-020, Korea;
3. Department of Materials Science & Engineering, Pusan National University, Busan 609-735, Korea;
4. Department of Materials Science & Engineering, Seoul National University of Technology, Seoul 139-743, Korea

Abstract:A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(RFID) inlay. The optimization condition for flip-chip bonding was determined from the behavior of bonding strength. Under the optimized condition, the shear strength for the antenna printed with paste-type Ag ink was larger than that for Cu antenna. Furthermore, an identification distance was varied from the antenna materials. Comparing with the Ag antenna pattern, the as-bonded die on Cu antenna showed a larger distance of identification. However, the long-term reliability of inlay using the Cu antenna was decreased significantly as a function of aging time at room temperature because of the bended shape of Cu antenna formed during the flip-chip bonding process.

 

Key words: RFID inlay; ACP; flip-chip, bonding process; reliability

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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