Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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Transactions of Nonferrous Metals Society of China

Vol. 13    No. 5    October 2003

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Effects of grain boundaries on electrical property of copper wires
YAN Wen(严 文), CHEN Jian(陈 建), FAN Xin-hui(范新会)

Department of Materials Science and Engineering,
Xi′an Institute of Technology, Xi′an 710032, China

Abstract:By means of annealing at different temperatures, the copper wires with various numbers of grain boundaries were achieved. And the resistivity of copper wires was measured. The results show that with increasing the number of grain boundaries, the resistivity of copper wires increases, the relationship between the number of grain boundaries and the resistivity of cooper wires can be expressed as y=1.86×10-8e-0.90/x. Unlike dislocation and lattice vacant sites, the curve of the grain boundary vs the resistivity is not linear. Grain boundary controls the general trend of the curve, but the type and the quantity of impurity controls the details of the curve.


Key words: copper wire; grain boundary; resistivity

ISSN 1004-0609
CN 43-1238/TG

ISSN 1003-6326
CN 43-1239/TG

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