Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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Transactions of Nonferrous Metals Society of China

Vol. 14    No. 3    June 2004

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Surface alloying of Cu with Ti by double glow discharge process
YUAN Qing-long(袁庆龙), CHI Cheng-zhong(池成忠), SU Yong-an(苏永安),
XU Zhong(徐 重), TNAG Bin(唐 宾)

Surface Engineering Research Institute, Taiyuan University of Technology,
Taiyuan 030024, China

Abstract:The surface of pure copper alloyed with Ti using double glow discharge process was investigated. The morphology, structure and forming mechanism of the Cu-Ti alloying layer were analyzed. The microhardness and wear resistance of the Cu-Ti alloying layer were measured, and compared with those of pure copper. The results indicate that the surface of copper activated by Ar and Ti ions bombardment is favorable to absorption and diffusion of Ti element. In current experimental temperature, as the Ti content increases, the liquid phase occurs between the deposited layer and diffused layer, which makes the Ti ions and atoms easy to dissolve and the thickness of Cu-Ti alloying layer increase rapidly. After cooling, the structure of the alloying layer is composed of CuTi, Cu4Ti and Cu(Ti) solid solution. The solid solution strengthening and precipitation strengthening effects of Ti result in high surface hardness and wear resistance.


Key words: titanizing; Cu-Ti alloying layer; double glow discharge process

ISSN 1004-0609
CN 43-1238/TG

ISSN 1003-6326
CN 43-1239/TG

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